This inventor holds 2 USPTO granted patents and 5 published patent applications. Top assignees: Shenzhen Goldsun Network Intelligence Technology Co., Ltd., Shenzhen Treasure City Technology Co., Ltd.. Active years: 2015.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
1 out of 32 
1 out of 37 Years Active: 2015
Title: Innovations of Shao-You Tang
Introduction
Shao-You Tang is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of electronics, particularly in the design of printed circuit boards and electromagnetic bandgap structures. With a total of 2 patents to his name, Tang's work showcases his expertise and innovative spirit.
Latest Patents
One of Tang's latest patents is for a printed circuit board (PCB) that includes a ground layer, a first layer, a second layer, a connector footprint, and a pair of differential signal lines. The connector footprint comprises first and second bonding pads. The PCB defines a first signal via in a central portion of a space bounded by the first bonding pad, and a second signal via in a central portion of a space bounded by the second bonding pad. A number of first ground vias on the first bonding pad and a number of second ground vias on the second bonding pad are electrically connected to the ground layer. First annular slots surrounding corresponding first ground vias are defined in the ground layer. Second annular slots surrounding corresponding second ground vias are defined in the ground layer. Connection slots are defined in the ground layer and communicate between the first annular slots and the second annular slots.
Another significant patent by Tang involves a stacked electromagnetic bandgap (EBG) device. This device features a stacked structure that includes a first ground plane, a first power plane, a via, a second power plane, a second ground plane, a third power plane, and several ground vias. The first ground plane, the second power plane, and the second ground plane are connected through the several ground vias. The ground vias and the second power plane do not have an actual electrical connection. The first ground plane, the first power plane, the second power plane, and the via form a first EBG structure, while the first ground plane, the second ground plane, the third power plane, and the several ground vias form a second EBG structure.
Career Highlights
Throughout his career, Shao-You Tang has worked with various companies, including Shenzhen Treasure City Technology Co., Ltd. and Shenzhen Goldsun Network Intelligence Technology Co., Ltd. His experience in these organizations has contributed to his development as an inventor and has allowed him to refine his skills in electronics and innovation.
Collaborations
Tang has collaborated with
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile