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For the Inventor, By the Inventor

Singapore, Singapore

Shao Ping Wan

This inventor holds 4 USPTO granted patents and 2 published patent applications. Top assignee: Infineon Technologies Ag. Active years: 2020-2023.

USPTO Granted Patents = 4 

% Patents Active = 100.0

Average Co-Inventor Count = 4.4

ph-index = 1

Forward Citations = 11(Granted Patents)


Company Filing History:

goldMedal4 out of 15,016 
 
Infineon Technologies Ag
 patents

Years Active: 2020-2023

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4 patents (USPTO):Explore Patents
1. 11817407 - Molded semiconductor package with high voltage isolation (2023-11-14),
2. 11444011 - Semiconductor package with leadframe interconnection structure (2022-09-13),
3. 11355460 - Molded semiconductor package with high voltage isolation (2022-06-07),
4. 10872848 - Semiconductor package with leadframe interconnection structure (2020-12-22),
Profile summary based on public USPTO records.
Please report any incorrect information to [email protected]
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