Taipei, Taiwan

Shao-Pin Ru

This inventor holds 4 USPTO granted patents and 7 published patent applications. Top assignees: Tong Hsing Electric Industries, Ltd., Tong Hsing Electronics Industries, Ltd.. Active years: 2004-2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Shao-Pin Ru. Retrieved from https://idiyas.com/inventor/shao-pin-ru

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 4 

% Patents Active = 100.0

Average Co-Inventor Count = 1.1

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2004-2019

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4 patents (USPTO):Explore Patents

Title: Innovations of Inventor Shao-Pin Ru

Introduction

Shao-Pin Ru is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of electronic packaging and integrated circuit fabrication. With a total of 4 patents, his work showcases innovative methods and structures that enhance the reliability and efficiency of electronic devices.

Latest Patents

One of his latest patents is titled "Waterproof electronic packaging structure and method for making the same." This invention includes a waterproof electronic packaging structure that consists of a carrier plate, a chip, an encapsulating member, and a waterproof member. The carrier plate features a substrate and a leadframe that is partly embedded in the substrate, with a chip bonding portion exposed. The chip is mounted on the substrate and is electrically connected to the bonding portion. The encapsulating member is formed on the carrier plate, encapsulating both the chip and the bonding portion. The waterproof member covers the outer surface of the encapsulating member and the interface between it and the substrate. Additionally, a method for creating this waterproof electronic packaging structure is disclosed.

Another significant patent is the "Method of fabricating a thin film integrated circuit with thick film resistors." This method involves a two-phase process for fabricating printed circuit boards that integrate thick film resistor components and thin film circuit portions. The first phase focuses on creating multiple thick film resistors, while the second phase involves forming a thin film circuit portion on the substrate with existing thick film resistors. This process eliminates the need for drilling holes or electroplating leads to the resistors, allowing for greater automation compared to conventional techniques.

Career Highlights

Shao-Pin Ru has worked with reputable companies such as Tong Hsing Electric Industries, Ltd. and Tong Hsing Electronics Industries, Ltd. His experience in these organizations has contributed to his expertise in electronic packaging and circuit fabrication.

Collaborations

One of his notable collaborators is Zzu-Chi Chiu, with whom he has worked on various innovative projects.

Conclusion

Shao-Pin Ru's contributions to the field of electronics through his patents and career experiences highlight his role as a significant inventor. His innovative approaches to waterproof packaging and integrated circuit fabrication continue to influence the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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