The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 06, 2019
Filed:
Jun. 27, 2017
Tong Hsing Electronic Industries, Ltd., Taipei, TW;
Shao-Pin Ru, Taipei, TW;
Zzu-Chi Chiu, Taipei, TW;
TONG HSING ELECTRONICS INDUSTRIES, LTD., Taipei, TW;
Abstract
A waterproof electronic packaging structure includes a carrier plate, a chip, an encapsulating member and a waterproof member. The carrier plate includes a substrate, and a leadframe partly embedded in the substrate and including a chip bonding portion exposed from the substrate. The chip is mounted to the substrate and is electrically connected to the chip bonding portion. The encapsulating member is formed on the carrier plate, and encapsulates the chip and the chip bonding portion. The waterproof member is formed on the encapsulating member, and covers an outer surface of the encapsulating member and an interface between the encapsulating member and the substrate. A method for making a waterproof electronic packaging structure is also disclosed.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile