Singapore, Singapore

Shao Ning Yuan

USPTO Granted Patents = 1 

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 2014

where 'Filed Patents' based on already Granted Patents

1 patent (USPTO):

Title: Shao Ning Yuan: Innovator in Back-side MOM/MIM Devices

Introduction

Shao Ning Yuan is a notable inventor based in Singapore, recognized for his contributions to the field of semiconductor technology. He has developed innovative solutions that enhance the functionality of electronic devices. His work primarily focuses on integrating back-side structures with front-side circuitry, which is crucial for modern electronic applications.

Latest Patents

Shao Ning Yuan holds a patent for "Back-side MOM/MIM devices." This invention involves the integration of back-side metal-oxide-metal (MOM) and metal-insulator-metal (MIM) structures on a substrate that features front-side circuitry. The patent outlines methods for forming a substrate with a front side and a back side, where the back side includes capacitors that connect to the front-side circuitry through a through-silicon via (TSV). This innovative approach enhances the performance and efficiency of electronic devices.

Career Highlights

Shao Ning Yuan is currently employed at Globalfoundries Singapore Pte. Ltd., where he continues to push the boundaries of semiconductor technology. His work has significantly contributed to advancements in the industry, making him a valuable asset to his team and the company.

Collaborations

Shao has collaborated with talented coworkers, including Juan Boon Tan and Yeow Kheng Lim. These collaborations have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

Shao Ning Yuan's contributions to the field of semiconductor technology, particularly through his patent on back-side MOM/MIM devices, highlight his role as an influential inventor. His work continues to impact the industry positively, paving the way for future innovations.

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