Shao-Heng Chang

Title: Innovations of Shao-Heng Chang in Wafer Technology

Introduction

Shao-Heng Chang is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the area of wafer processing. His innovative methods have the potential to enhance the precision and efficiency of die separation in semiconductor manufacturing.

Latest Patents

Shao-Heng Chang holds a patent for a method titled "Method for die separation of a wafer by ion implantation." This invention focuses on improving die separation precision to a sub-micron level while reducing die spacing. The process involves implanting gaseous ions into the wafer's split lines, followed by heat treatment to facilitate wafer splitting. The resulting separated dies exhibit cleavage roughness at a nano-meter level, showcasing the advanced capabilities of this method.

Career Highlights

Shao-Heng Chang is affiliated with the Industrial Technology Research Institute, where he continues to work on innovative solutions in semiconductor technology. His expertise and dedication to research have positioned him as a key figure in the development of advanced manufacturing techniques.

Collaborations

Shao-Heng Chang collaborates with talented individuals such as Hung-Yi Lin and Fuh-Yu Chang. Their combined efforts contribute to the advancement of technology in their field.

Conclusion

Shao-Heng Chang's contributions to wafer technology through his innovative patent demonstrate his commitment to enhancing semiconductor manufacturing processes. His work continues to influence the industry positively.