Shao-An Yan

Title: Innovations of Shao-An Yan

Introduction

Shao-An Yan is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of chip packaging and redistribution structures. With a total of 4 patents to his name, Yan's work has advanced the technology used in electronic devices.

Latest Patents

One of his latest patents is a chip package structure that includes a substrate, a redistribution layer (RDL), a chip, and an encapsulant. This innovative design ensures that the chip is located in a high-stress region, surrounded by a low-stress region, optimizing its performance. Another notable patent is related to a redistribution structure and its forming method. This structure features a first redistribution layer that includes a dielectric layer and at least one conductive structure, achieving a high degree of planarization.

Career Highlights

Shao-An Yan has worked with esteemed organizations such as the Industrial Technology Research Institute and the Intellectual Property Innovation Corporation. His experience in these institutions has allowed him to refine his skills and contribute to groundbreaking innovations in his field.

Collaborations

Throughout his career, Yan has collaborated with notable colleagues, including Chieh-Wei Feng and Tai-Jui Wang. These partnerships have fostered a creative environment that has led to the development of advanced technologies.

Conclusion

Shao-An Yan's contributions to the field of chip packaging and redistribution structures highlight his innovative spirit and dedication to advancing technology. His patents reflect a commitment to improving electronic device performance and reliability.