Shankar Srinivasa Tangirala

Title: Shankar Srinivasa Tangirala: Innovator in Multi-Die Systems

Introduction

Shankar Srinivasa Tangirala is a notable inventor based in Mountain View, CA. He has made significant contributions to the field of multi-die systems, particularly in enabling die-to-die communication. His innovative work has led to the development of a patent that enhances the efficiency and modularity of data transmission between dies.

Latest Patents

Shankar holds a patent for "Multi-die systems with modular die-to-die link macros for enabling die-to-die communication." This patent describes a multi-die system that includes a first die with a set of modular die-to-die (D2D) transmit and receive link macros. The system also features a second die, coupled to the first die via D2D links, which comprises its own set of modular D2D transmit and receive link macros. Each macro maintains the same physical shape, size, and bandwidth capacity, allowing for flexible combinations of bandwidth and edge depths for both dies.

Career Highlights

Shankar is currently associated with Microsoft Technology Licensing, LLC, where he continues to innovate and develop advanced technologies. His work focuses on improving communication systems within multi-die architectures, which is crucial for modern computing applications.

Collaborations

Some of Shankar's coworkers include Charles Walter Boecker and Jin Liang. Their collaborative efforts contribute to the advancement of technology in the field of multi-die systems.

Conclusion

Shankar Srinivasa Tangirala is a prominent inventor whose work in multi-die systems has paved the way for improved communication technologies. His patent reflects a significant advancement in the field, showcasing his innovative spirit and dedication to enhancing data transmission systems.