The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 2026
Filed:
Jun. 11, 2024
Microsoft Technology Licensing, Llc, Redmond, WA (US);
Charles Walter Boecker, Ames, IA (US);
Jin Liang, Apex, NC (US);
Michael Raymond Trombley, Cary, NC (US);
Jonathan Holland, Cary, NC (US);
Eric Douglas Groen, Ankeny, IA (US);
Ping Lu, Cary, NC (US);
Simon Shichi Li, Cupertino, CA (US);
Shankar Srinivasa Tangirala, Mountain View, CA (US);
Shaishav A. Desai, San Jose, CA (US);
Roxanne Vu, San Jose, CA (US);
Ravi Shivnaraine, Pickering, CA;
Microsoft Technology Licensing, LLC, Redmond, WA (US);
Abstract
Multi-die systems with modular die-to-die link macros for enabling die-to-die communication are described. A multi-die system includes a first die comprising a first set of modular die-to-die (D2D) transmit link macros and a first set of modular D2D receive link macros. The multi-die system further includes a second die, coupled to the first die via die-to-die (D2D) links, comprising a second set of modular D2D transmit link macros and a second set of modular D2D receive link macros. Each of the transmit/receive macros has the same physical shape, size, and the bandwidth capacity. The modularity associated with respective modular D2D transmit link macros and respective modular D2D receive link macros allows different combinations of an amount of bandwidth for data being transmitted or received via the D2D links and different amounts of edge depths for the first die and the second die along the die edge.