Taipei, Taiwan

Shang-Jan Yang

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Chipbond Technology Corporation. Active years: 2021.

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2021

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1 patent (USPTO):Explore Patents

Title: Innovations by Shang-Jan Yang in Semiconductor Technology

Introduction

Shang-Jan Yang is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly with his innovative designs and methods. His work has garnered attention for its potential applications in various electronic devices.

Latest Patents

Shang-Jan Yang holds a patent for a semiconductor device having a 3D inductor. This invention includes a first transverse inductor, a longitudinal inductor, and a second transverse inductor. The first transverse inductor is formed on a first substrate, while the second transverse inductor and the longitudinal inductor are formed on a second substrate. The second substrate is bonded to the first substrate to connect the first transverse inductor and the longitudinal inductor, creating a cohesive 3D inductor structure. This innovative design enhances the performance and efficiency of semiconductor devices.

Career Highlights

Shang-Jan Yang is currently employed at Chipbond Technology Corporation, where he continues to develop cutting-edge semiconductor technologies. His expertise in the field has positioned him as a valuable asset to the company and the industry at large.

Collaborations

Shang-Jan Yang has collaborated with notable colleagues, including Cheng-Hung Shih and Nian-Cih Yang. These partnerships have fostered a creative environment that encourages innovation and the advancement of semiconductor technology.

Conclusion

Shang-Jan Yang's contributions to semiconductor technology, particularly through his patent for a 3D inductor, highlight his role as a leading inventor in the field. His work at Chipbond Technology Corporation and collaborations with esteemed colleagues further emphasize his impact on the industry.

Profile summary based on public USPTO records.
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