Shang-Chin Sung

Title: Innovations by Shang-Chin Sung in Semiconductor Technology

Introduction

Shang-Chin Sung is a notable inventor based in Tainan, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the area of electroplating methods. His innovative approaches have the potential to enhance the manufacturing processes of semiconductor devices.

Latest Patents

Shang-Chin Sung holds a patent for a method titled "Copper plating of semiconductor devices using single intermediate low power immersion step." This patent describes a process for electroplating a metal layer on a semiconductor device. The method includes a sequence of biasing operations that starts with a first electroplating step at a specific current density, followed by a second immersion step at a lower current density. This innovative approach improves the quality of the plating process, ensuring that the plated film completely fills openings such as vias and trenches. It effectively avoids issues like hollow vias and pull-back at the bottom corners of these openings. The low current density immersion step also contributes to a reduction in contact resistance, thereby minimizing device failure.

Career Highlights

Shang-Chin Sung is associated with Taiwan Semiconductor Manufacturing Company Limited, a leading player in the semiconductor industry. His work has been instrumental in advancing the techniques used in semiconductor manufacturing, particularly through his patented methods.

Collaborations

Shang-Chin Sung has collaborated with notable colleagues, including Chao-Lung Chen and Kei-Wei Chen. Their combined expertise has contributed to the development of innovative solutions in semiconductor technology.

Conclusion

Shang-Chin Sung's contributions to semiconductor technology through his innovative patent demonstrate his commitment to improving manufacturing processes. His work continues to influence the industry positively.