Warley, United Kingdom

Shakeel Akhtar

This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Atotech Deutschland Gmbh. Active years: 2013.


 

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2013

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1 patent (USPTO):Explore Patents

Title: Shakeel Akhtar: Innovator in Metal Plating Technology

Introduction

Shakeel Akhtar is a notable inventor based in Warley, GB. He has made significant contributions to the field of metal plating, particularly through his innovative patent that addresses challenges in the fabrication of rigid memory disks. His work is characterized by a focus on improving the quality and efficiency of plating processes.

Latest Patents

Shakeel Akhtar holds a patent for a "Metal plating additive, and method for plating substrates and products therefrom." This invention is directed towards the fabrication of rigid memory disks and includes a metal plating composition that impedes the deposition of non-metallic particles during the plating process. The composition features at least one sulfated fatty acid ester additive, which has a zeta potential that helps prevent the deposit of non-metallic particles. This innovative approach enhances the overall quality of the plating process.

Career Highlights

Shakeel Akhtar is currently associated with Atotech Deutschland GmbH, a company known for its expertise in surface finishing and plating technologies. His role at Atotech has allowed him to further develop his skills and contribute to advancements in metal plating.

Collaborations

Shakeel has collaborated with notable colleagues such as Kevin Schell and Grant Keers. These collaborations have fostered an environment of innovation and have contributed to the development of cutting-edge technologies in the field.

Conclusion

Shakeel Akhtar's contributions to metal plating technology through his patent and work at Atotech Deutschland GmbH highlight his role as an influential inventor in this specialized field. His innovative approaches continue to shape the future of plating processes.

Profile summary based on public USPTO records.
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