Cheonan, South Korea

Seunggon Park

This inventor holds 4 USPTO granted patents and 2 published patent applications and 2 EPO patents. Top assignees: Amosense Co., Ltd, Amosense Co., Ltd.. Active years: 2025-2026.

USPTO Granted Patents = 4 

% Patents Active = 50.0

 

Average Co-Inventor Count = 5.5

ph-index = 1


Company Filing History:


Years Active: 2025-2026

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4 patents (USPTO):Explore Patents

Title: Seunggon Park: Innovator in Power Module Technology

Introduction

Seunggon Park is a notable inventor based in Cheonan, South Korea. He has made significant contributions to the field of power module technology, holding a total of 4 patents. His innovative designs focus on enhancing the efficiency and reliability of power modules.

Latest Patents

One of his latest patents is a power module and method for manufacturing the same. This invention includes a lower ceramic substrate and an upper ceramic substrate, which is spaced apart from the lower substrate. A semiconductor chip is mounted on the lower surface of the upper ceramic substrate. The design incorporates spacers that maintain a constant distance between the two substrates, thereby protecting the semiconductor chip and improving heat dissipation efficiency. Another patent relates to a power module that features a PCB substrate and a connection pin that minimizes the electrical connection distance, enhancing the efficiency of high-speed current movement.

Career Highlights

Seunggon Park has worked with Amosense Co., Ltd, where he has applied his expertise in power module technology. His work has contributed to advancements in the field, showcasing his commitment to innovation.

Collaborations

He has collaborated with notable coworkers such as Taeho Cho and Intae Yeo, further enriching his professional experience and contributions to the industry.

Conclusion

Seunggon Park's innovative work in power module technology demonstrates his significant impact on the field. His patents reflect a dedication to improving efficiency and reliability in electronic components.

Profile summary based on public USPTO records.
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