The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2026
Filed:
Jul. 01, 2021
Amosense Co., Ltd, Cheonan-si, KR;
Intae Yeo, Cheonan-si, KR;
Taeho Cho, Cheonan-si, KR;
Jinhyuck Bin, Cheonan-si, KR;
Seunggon Park, Cheonan-si, KR;
Wonsan Na, Cheonan-si, KR;
Taejung Kim, Cheonan-si, KR;
Jihyung Lee, Cheonan-si, KR;
AMOSENSE CO., LTD., Cheonan-si, KR;
Abstract
The present invention relates to a power module comprising: a lower ceramic substrate (); an upper ceramic substrate () which is disposed above the lower ceramic substrate () and has a semiconductor chip (G) mounted on the lower surface thereof; a PCB substrate () disposed above the upper ceramic substrate (); and a connection pin () which extends through through holes (and) formed in the upper ceramic substrate () and the PCB substrate (), and vertically connects electrode patterns (a, b, c, and d) formed on the upper ceramic substrate () and the PCB substrate (). The present invention provides a shortened electrical connection distance between the upper ceramic substrate and the PCB substrate, and thus can minimize a current path and enhance the moving efficiency of a high-speed current.