This inventor holds 1 USPTO granted patent. Top assignee: Samsung Electronics Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Seungchul Oh: Semiconductor Packaging Inventor
Introduction
Seungchul Oh is an inventor based in Suwon-si, South Korea. His patent work concerns semiconductor package manufacturing and package structure.
Latest Patents
Oh is associated with 1 patent: “Semiconductor Package Manufacturing Method and Semiconductor Package.” The invention describes adding an insulating frame to a carrier substrate so that it covers the side surface of a first metal layer. A cover insulating layer is then brought into contact with the frame and metal layer, and covers at least one semiconductor chip.
Career Highlights
Oh is associated with Samsung Electronics Ltd. His patent focuses on insulating structures and manufacturing steps used in semiconductor packaging.
Collaborations
His listed coworkers include Junwoo Myung and Jangbae Son.
Conclusion
Seungchul Oh’s patent reflects work on semiconductor package manufacturing, particularly the use of insulating layers and frames in package construction.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile