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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12740470 B1

PDFFull Text
Date of Patent:
Sep. 15, 2026

Filed:

May. 25, 2023

Semiconductor package manufacturing method and semiconductor package

Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Seungchul Oh, Suwon-si, KR;

Junwoo Myung, Suwon-si, KR;

Jangbae Son, Suwon-si, KR;

Gun Lee, Suwon-si, KR;

Assignee:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Attorney:

Wolf, Greenfield & Sacks, P.C.

Primary Examiner:

Wael M Fahmy

Assistant Examiner:

Quinton A Brasfield

Int. Cl.
CPC ...
H10W 74/10 (2026.01); H10W 42/00 (2026.01); H10W 70/685 (2026.01); H10W 74/01 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 74/117 (2026.01); H10W 42/121 (2026.01); H10W 70/685 (2026.01); H10W 74/019 (2026.01); H10W 74/121 (2026.01); H10W 90/724 (2026.01);
Abstract

A method of manufacturing a semiconductor package includes adding an insulating frame to a surface of a carrier substrate, wherein the insulating frame covers a side surface of a first metal layer on the surface of the carrier substrate and bringing a cover insulating layer into contact with the insulating frame and the first metal layer, wherein the cover insulating layer covers at least one semiconductor chip.

Find Patent Forward Citations

Oh, Seungchul. (2026). Semiconductor package manufacturing method and semiconductor package (U.S. Patent No. 12740470). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12740470

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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