Seung-yeol Yang

Introduction

Seung-yeol Yang is an accomplished inventor based in Hwaseong-si, South Korea. With a strong emphasis on semiconductor technology, Yang has made significant contributions to the field through his innovative designs and methods.

Latest Patents

Yang holds a patent for a semiconductor package, a method of fabricating the same, and a semiconductor package mold. This invention encompasses a semiconductor package that includes one or more semiconductor chips, designed to enhance functionality. The package features a first semiconductor chip mounted on a substrate, delineated by a first surface with a center portion and multiple conductive connection pad groups. Additionally, the package has a molding member that covers the semiconductor chip and incorporates an extension that circumvents the pad groups. Furthermore, Yang's invention allows for a second semiconductor chip package to be stacked on top, enhancing connectivity and efficiency.

Career Highlights

Seung-yeol Yang is currently affiliated with Samsung Electronics Co., Ltd., a leading company in the technology sector. His work involves advancing semiconductor technologies, making him an integral part of their research and development team. With one patent to his name, Yang remains focused on further innovations within this dynamic field.

Collaborations

Throughout his career, Yang has collaborated with esteemed colleagues, including Sang-Wook Park and Seung-Jae Lee. These collaborations signify a strong network of professionals committed to pushing the boundaries of semiconductor engineering.

Conclusion

Seung-yeol Yang is a notable figure in the semiconductor field, with his patent showcasing significant advancements in semiconductor packaging. With his ties to Samsung Electronics Co., Ltd. and his collaborative efforts with fellow inventors, Yang is set to continue influencing innovations in technology. His contributions highlight the importance of creativity and engineering in shaping the future of semiconductor applications.