Seung Soo Ha

Title: Seung Soo Ha: Innovator in Semiconductor Technology

Introduction

Seung Soo Ha is a prominent inventor based in Suwon-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on innovative packaging solutions that enhance the performance and efficiency of semiconductor devices.

Latest Patents

One of Seung Soo Ha's latest patents is a fan-out semiconductor package. This invention includes a core member with a through-hole, where a semiconductor chip is positioned. The chip features an active surface with connection pads and an inactive surface opposing it. An encapsulant surrounds portions of both the core member and the semiconductor chip, filling part of the through-hole. Additionally, a connection member is placed on the core member and the active surface of the semiconductor chip, which includes a redistribution layer that is electrically connected to the connection pads. The core member also has a groove portion that penetrates from the wall of the through-hole to the outer side surface of the core member, located in the lower portion where the connection member is situated.

Career Highlights

Seung Soo Ha is currently employed at Samsung Electronics Co., Ltd., a leading company in the electronics industry. His role involves developing advanced semiconductor packaging technologies that are crucial for modern electronic devices.

Collaborations

Throughout his career, Seung Soo Ha has collaborated with notable colleagues, including Hyeon Seok Lee and Sun Ho Kim. These collaborations have contributed to the advancement of semiconductor technologies and innovations.

Conclusion

Seung Soo Ha's contributions to semiconductor technology through his patents and work at Samsung Electronics Co., Ltd. highlight his role as an influential inventor in the industry. His innovative approaches continue to shape the future of electronic devices.