Seung Hee Lee

Title: **Inventor Spotlight: Seung Hee Lee**

Introduction

Seung Hee Lee is a notable inventor based in Suwon, South Korea, recognized for his contributions to innovative technology. With three patents to his name, he plays a pivotal role in advancing the field of wireless power transmission and surface acoustic wave technologies.

Latest Patents

Seung Hee Lee's most recent patents include:

1. **Wireless Power Transmitter and Method of Controlling the Same**: This innovation features a wireless power transmitter that includes a resonator designed to transmit a detection signal. A period detector is utilized to identify the oscillation period resulting from remnants of the detection signal. The controller is responsible for determining the approach of an external charging object based on changes in the period of the oscillation signal.

2. **Stack Type Surface Acoustic Wave Package and Method for Manufacturing the Same**: This patent discloses a stack type surface acoustic wave package comprising two bare chips with electrodes and via-holes. The design includes a connecting portion that electrically links both chips, creating an air-tight space to enhance reliability, minimize product size, and reduce manufacturing costs through fewer components and materials.

Career Highlights

Currently, Seung Hee Lee is associated with Samsung Electro-Mechanics Co., Ltd., where he continues to innovate and develop ground-breaking technologies. His work demonstrates a strong commitment to enhancing product reliability and efficiency within the electronics sector.

Collaborations

Throughout his career, Seung Hee Lee has collaborated with distinguished colleagues, including Doo Cheol Park and Joo Hun Park. Their joint efforts and expertise contribute to the innovative projects at Samsung Electro-Mechanics, fostering a collaborative environment devoted to technological advancement.

Conclusion

In summary, Seung Hee Lee stands out as a significant figure in the realm of technology innovation. With a focus on wireless power transmission and surface acoustic wave packaging, he remains dedicated to pushing the boundaries of what is possible in electronics, enhancing both product performance and manufacturability.