The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 26, 2010
Filed:
Aug. 24, 2009
Seung Hee Lee, Kyungki-Do, KR;
Doo Cheol Park, Kyungki-Do, KR;
Joo Hun Park, Kyungki-Do, KR;
Young Jin Lee, Kyungki-Do, KR;
Sang Wook Park, Kyungki-Do, KR;
Nam Hyeong Kim, Kyungki-Do, KR;
Seung Hee Lee, Kyungki-Do, KR;
Doo Cheol Park, Kyungki-Do, KR;
Joo Hun Park, Kyungki-Do, KR;
Young Jin Lee, Kyungki-Do, KR;
Sang Wook Park, Kyungki-Do, KR;
Nam Hyeong Kim, Kyungki-Do, KR;
Samsung Electro-Mechanics Co., Ltd., Suwon, Kyungki-do, KR;
Abstract
Disclosed herein is a stack type surface acoustic wave package. The surface acoustic wave package comprises a first bare chip having a plurality of electrodes formed thereon, a second bare chip having a plurality of electrodes and via-holes formed thereon, a connecting portion electrically connecting the first bare chip to an upper surface of the second bare chip such that the electrodes of the first bare chip face the electrodes of the second bare chip, and a sealing member provided on the first and second bare chips to form an air-tight space on an operating surface between the first and second bare chips. The surface acoustic wave package can prevent deformation due to thermal impact from the outside during a packaging process, enhancing reliability of the product, minimizing the size of the product, and reducing manufacturing costs by reducing the number of components and material costs.