Seung Duk Baek

Title: Seung Duk Baek: Innovator in Semiconductor Packaging

Introduction

Seung Duk Baek is a prominent inventor based in Gyeonggi-do, South Korea. He has made significant contributions to the field of semiconductor packaging, holding a total of 4 patents. His work focuses on enhancing the reliability and performance of semiconductor devices.

Latest Patents

Baek's latest patents include innovative designs for semiconductor packages. One of his patents describes a semiconductor package that features a substrate with multiple semiconductor chips and heat transfer components. This design effectively manages heat generated from the chips, improving product reliability. Another patent outlines a semiconductor package that includes a first and second heat spreader, which work together to optimize thermal management and enhance device performance.

Career Highlights

Seung Duk Baek is currently employed at Samsung Electronics Co., Ltd., a leading company in the technology sector. His work at Samsung has allowed him to push the boundaries of semiconductor technology, contributing to advancements that benefit various electronic applications.

Collaborations

Baek has collaborated with notable colleagues, including Dong Joo Choi and Dong Hyeon Jang. These partnerships have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

Seung Duk Baek's contributions to semiconductor packaging exemplify his commitment to innovation in technology. His patents reflect a deep understanding of thermal management in semiconductor devices, positioning him as a key figure in the industry.