The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 2009
Filed:
Jan. 26, 2006
Applicant:
Seung Duk Baek, Gyeonggi-do, KR;
Inventor:
Seung Duk Baek, Gyeonggi-do, KR;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/535 (2006.01);
U.S. Cl.
CPC ...
Abstract
Packaged integrated circuit devices include a package substrate and a multi-chip stack of integrated circuit devices on the package substrate. The multi-chip stack includes at least one chip-select rerouting conductor. This rerouting conductor extends from the package substrate to a chip pad on an upper one of the chips in the multi-chip stack. The chip-select rerouting conductor extends through a first via hole in a lower one of the chips in the multi-chip stack.
Quick Actions:
Baek, Seung. (2009). Integrated circuit chip having pass-through vias therein that extend between multiple integrated circuits on the chip (U.S. Patent No. 7595559). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7595559
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile