Setsuko J Cole

Title: The Innovations of Setsuko J Cole

Introduction

Setsuko J Cole is a prominent inventor based in Phoenix, AZ, known for her significant contributions to the field of integrated circuit technology. With a total of two patents to her name, she has developed innovative methods that enhance the functionality and reliability of electronic devices.

Latest Patents

Cole's latest patents include the "Planar Encapsulation Process," which is a method for encapsulating the surface of an integrated circuit to protect it. This process involves a frame for handling the integrated circuit package, with leads coupled between the frame and the outer peripheral area. The encapsulation material is dispensed to cover and protect both the leads and the integrated circuit, ensuring a planar surface for optimal performance. Another notable patent is the "Bonding Method and Apparatus," which describes a technique for bonding that involves heating a bottom thermode to approximately 150 degrees Celsius, followed by pulse heating to around 350 degrees Celsius. This method allows for effective contact between the lead frame and the die, enhancing the bonding process.

Career Highlights

Setsuko J Cole has made a significant impact during her career at Motorola Corporation, where she has applied her expertise in integrated circuit technology. Her innovative approaches have contributed to advancements in the electronics industry, showcasing her skills as a leading inventor.

Collaborations

Throughout her career, Cole has collaborated with notable colleagues, including Glenn D Raskin and Mark C Hoggatt. These partnerships have fostered an environment of innovation and creativity, further enhancing the development of her patented technologies.

Conclusion

Setsuko J Cole's contributions to the field of integrated circuits through her patents demonstrate her expertise and commitment to innovation. Her work continues to influence the electronics industry, making her a noteworthy figure in the realm of invention.