The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 03, 1989

Filed:

May. 23, 1988
Applicant:
Inventors:

Harry J Geyer, Phoenix, AZ (US);

James H Knapp, Gilbert, AZ (US);

Setsuko J Cole, Phoenix, AZ (US);

Assignee:

Motorola Inc., Schaumburg, IL (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K / ;
U.S. Cl.
CPC ...
228106 ; 228-55 ; 2281802 ; 228239 ;
Abstract

A method for bonding which comprises the step of heating a bottom thermode to a temperature of approximately 150.degree. C. The bottom thermode is then pulse heated to approximately 350.degree. C. while a die and lead frame are disposed above the lower thermode. An upper thermode, which may remain unheated, is then lowered to cause contact between the lead frame and the contacts of the die. The lower thermode then returns to a temperature of approximately 150.degree. C. The pulse heating of the lower thermode lasts for approximately 1-3 seconds.


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