This inventor holds 1 USPTO granted patent, plus 1 CIPO patent. Top assignee: Tessonics Corporation. Active years: 2018.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2018
Title: **Innovator Spotlight: Sergey Aleksandrovich Titov**
Introduction
Sergey Aleksandrovich Titov is a distinguished inventor based in Moscow, Russia. He is recognized for his innovative contributions to the field of materials science and engineering, particularly in the assessment of adhesive bonds. His work has significant implications for manufacturing and quality control processes.
Latest Patents
Titov holds a notable patent titled **"Method and system for assessing the quality of adhesively bonded joints using ultrasonic waves."** This patent describes a comprehensive method for evaluating the quality of adhesively bonded lap joints. The process involves sending ultrasonic waves to the surface of a sample that replicates the properties of the metal plates used in the joint. By comparing reflected waveforms, the quality of the joint can be assessed accurately using a threshold value to determine its integrity.
Career Highlights
Sergey Titov is associated with Tessonics Corporation, where he applies his expertise in ultrasonic testing and materials evaluation. His role in the company has allowed him to focus on advancing methodologies that improve the reliability of bonded joints in various applications, which is vital for industries reliant on strong and durable materials.
Collaborations
Throughout his career, Titov has collaborated with notable colleagues such as Roman Maev and Alexey Nikolaevich Bogachenkov. Working alongside such talented individuals has fostered an environment of innovation and excellence, leading to the development of cutting-edge technologies that enhance adhesive bonding assessments.
Conclusion
Sergey Aleksandrovich Titov's inventive work, particularly in ultrasonic assessment of adhesive joints, exemplifies the importance of innovation in engineering. His contributions not only advance the field but also ensure greater safety and quality in manufacturing processes. His ongoing efforts at Tessonics Corporation and collaborations highlight the significance of teamwork in driving successful innovations.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
