Birmingham, MI, United States of America

Tessonics Corporation


USPTO Granted Patents = 14



Trademarks = 1

Forward Citations = 16

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27 inventors (with patents filed for the assignee):

goldMedal Roman Gr Maev (8 out of 19 patents)

silverMedal Eugene Malyarenko (4 out of 5 patents)

bronzeMedal Volf Leshchynsky (4 out of 4 patents)

4.  Emil E Strumban (4 out of 9 patents)

5.  Roman Maev (3 out of 6 patents)

6.  Dmitry Dzhurinskiy (3 out of 3 patents)

7.  Roman Gr Maev (3 out of 3 patents)

8.  Andriy Chertov (3 out of 3 patents)

9.  Damir Ziganshin (2 out of 2 patents)

10.  Raymond Belenkov (2 out of 2 patents)

11.  Jeffrey T Sadler (2 out of 2 patents)

12.  Andriy M Chertov (2 out of 2 patents)

13.  Danilo Stocco (2 out of 2 patents)

14.  Donald Ryan Scott (2 out of 2 patents)

15.  Alexander Ilyutovich (1 out of 1 patent)


14 patents:

Company Overview
Tessonics Corporation, based in Birmingham, MI, specializes in advanced acoustic technologies and solutions. The company focuses on the development and manufacturing of innovative products that leverage sound and vibration analysis for various applications. Tessonics is dedicated to enhancing performance and reliability across multiple sectors, including automotive and industrial engineering. By integrating cutting-edge research with practical applications, Tessonics aims to address complex challenges in sound management and acoustic optimization.
Profile summary synthesized from public USPTO records and patent filings.

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USPTO Data Jan 1 1976 - Oct 13 2026

Tessonics Corporation USPTO Patent Assignee Logo
14 Patents

#2 in Birmingham, MI

#788 in Michigan

#22,319 in US

#42,249 in the World

Birmingham, MI (US)
Birmingham, MI, United States of America
Forward Citations = 16

27 inventors:

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Tessonics Corporation. Retrieved from https://idiyas.com/company/tessonics

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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