Munich, Germany

Sergej Scherer

This inventor holds 1 USPTO granted patent. Top assignee: Avago Technologies International Sales Pte. Limited. Active years: 2018.


% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 2018

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1 patent (USPTO):Explore Patents

Title: The Innovations of Sergej Scherer

Introduction

Sergej Scherer is a notable inventor based in Munich, Germany. He has made significant contributions to the field of electronic packaging through his innovative designs and patents. His work focuses on enhancing the structural integrity and functionality of electronic components.

Latest Patents

One of Sergej Scherer's key patents is titled "Frame elements for package structures comprising printed circuit boards (PCBs)." This invention includes a substrate, an electronic component disposed over the substrate, and a frame element that provides structural rigidity to the apparatus. Additionally, the apparatus features an encapsulating material covering the upper surface of the substrate, the electronic component, and the frame element. An electrically conductive layer is also included over the encapsulating material. This patent showcases his expertise in creating efficient and reliable electronic packaging solutions. He holds 1 patent.

Career Highlights

Sergej Scherer is currently employed at Avago Technologies International Sales Pte. Limited, where he continues to develop innovative solutions in the electronics sector. His work has been instrumental in advancing the technology used in electronic packaging, making it more robust and efficient.

Collaborations

Throughout his career, Sergej has collaborated with talented professionals, including Bernhard Gebauer and Martin Fritz. These partnerships have allowed him to enhance his inventions and contribute to the field of electronics more effectively.

Conclusion

Sergej Scherer is a prominent inventor whose work in electronic packaging has led to significant advancements in the industry. His innovative patent demonstrates his commitment to improving the structural integrity of electronic components. His contributions continue to influence the field positively.

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