The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 13, 2018

Filed:

Oct. 30, 2015
Applicant:

Avago Technologies General Ip (Singapore) Pte. Ltd., Singapore, SG;

Inventors:

Martin Fritz, Munich, DE;

Bernhard Gebauer, Tuntenhausen, DE;

Lueder Elbrecht, Munich, DE;

Martin Handtmann, Riemerling, DE;

Oliver Wiedenmann, Munich, DE;

Sergej Scherer, Munich, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H01L 23/552 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0216 (2013.01); H01L 23/552 (2013.01); H05K 1/0298 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/181 (2013.01); H05K 1/181 (2013.01); H05K 3/284 (2013.01); H05K 999/99 (2013.01); H05K 2201/2018 (2013.01); H05K 2203/1316 (2013.01);
Abstract

An apparatus, includes a substrate, an electronic component disposed over the substrate, and a frame element disposed over the substrate. The frame element provides structural rigidity to the apparatus. The apparatus also includes an encapsulating material disposed over an upper surface of the substrate, the electronic component and the frame element. An electrically conductive layer is disposed over the encapsulating material.


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