Seong Dae Park

Title: Innovations of Seong Dae Park in Composite Resin Technology.

Introduction

Seong Dae Park is an accomplished inventor based in Seoul, South Korea. He has made significant contributions to the field of composite resin technology, particularly in the development of thermally curable composite resin compositions.

Latest Patents

Seong Dae Park holds a patent for a "Thermally curable composite resin composition, prepreg, composite film and laminated material for circuit having the same." This invention relates to a prepreg, a composite film, and a laminated material for circuits used in thermosetting composite resin compositions and printed circuit boards. The innovation focuses on a thermosetting composite resin composition mixed with Cyclo Olefin Polymer (COP) and thermally cross-linkable resin. This blend allows for a lower dielectric constant and reduced dielectric loss compared to conventional composite resin compositions. Additionally, inorganic fillers such as ceramic materials, metal materials, and carbon black are incorporated to achieve dielectric characteristics that range from low to high dielectric constants.

Career Highlights

Seong Dae Park is affiliated with the Korea Electronics Technology Institute, where he continues to advance research in electronic materials and technologies. His work has been pivotal in enhancing the performance of printed circuit boards through innovative composite materials.

Collaborations

Seong Dae Park collaborates with notable colleagues, including Woo Sung Lee and Se Hoon Park, contributing to a dynamic research environment focused on cutting-edge technology.

Conclusion

Seong Dae Park's contributions to thermally curable composite resin technology exemplify the innovative spirit of modern inventors. His work not only advances the field but also sets a foundation for future developments in electronic materials.