The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 21, 2011
Filed:
Sep. 18, 2007
Myong Jae Yoo, Seoul, KR;
Woo Sung Lee, Seongnam-si, KR;
Seong Dae Park, Seoul, KR;
SE Hoon Park, Seongnam-si, KR;
Myong Jae Yoo, Seoul, KR;
Woo Sung Lee, Seongnam-si, KR;
Seong Dae Park, Seoul, KR;
Se Hoon Park, Seongnam-si, KR;
Korea Electronics Technology Institute, Gyeonggi-do, KR;
Abstract
The present invention relates to a prepreg, a composite film, and a laminated material for circuit used for thermosetting composite resin compositions and printed circuit boards, and particularly to a thermosetting composite resin composition mixed with COP (Cyclo Olefin Polymer) and thermally cross-linkable resin, wherein the COP having excellent electrical characteristics at a high frequency and thermally cross-linkable resin are blended to allow having a less dielectric constant and a less dielectric loss than those of the conventional composite resin composition, and inorganic fillers such as ceramic material, metal material, carbon black are added to allow having dielectric characteristics covering from a low dielectric constant to a high dielectric constant.