This inventor holds 3 USPTO granted patents and 7 published patent applications. Top assignees: Samsung Electronics Co., Ltd., Samsung Electronics Ltd.. Active years: 2022-2026.
Company Filing History:
2 out of 132,108 
1 out of 5,871 Years Active: 2022-2026
Title: Seokbong Park: Innovator in Semiconductor Technology
Introduction
Seokbong Park is a notable inventor based in Suwon-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding two patents that showcase his innovative approach to semiconductor packaging.
Latest Patents
His latest patents focus on advanced semiconductor packages. One of the patents describes a semiconductor package that includes a lower connection structure, a semiconductor chip positioned on this structure, and an upper connection structure. This upper structure features a first conductive pattern layer on the semiconductor chip, followed by a first insulating layer. Additionally, a second conductive pattern layer is placed on the first insulating layer, with a first via that penetrates the first insulating layer to connect the first and second conductive pattern layers. A second insulating layer extends between the side surface of the first via and the first insulating layer, along with an intermediate connection structure linking the lower and upper connection structures. Notably, the chemical composition of the first insulating layer may differ from that of the second insulating layer.
Career Highlights
Seokbong Park is currently employed at Samsung Electronics Co., Ltd., where he continues to push the boundaries of semiconductor technology. His work has been instrumental in developing innovative solutions that enhance the performance and reliability of semiconductor packages.
Collaborations
Throughout his career, Seokbong Park has collaborated with talented individuals such as Joonsung Kim and Doohwan Lee. These collaborations have contributed to the successful development of his patented technologies.
Conclusion
Seokbong Park is a prominent figure in the semiconductor industry, recognized for his innovative patents and contributions to technology. His work at Samsung Electronics Co., Ltd. continues to influence the future of semiconductor packaging.