Changwon-si, South Korea

Seok Kim

This inventor holds 1 USPTO granted patent. Top assignee: Changwon National University Industry Academy Cooperation Corps. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Seok Kim. Retrieved from https://idiyas.com/inventor/seok-kim-8gd4hy3q

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Seok Kim - Innovator in Omniphobic Surface Manufacturing

Introduction

Seok Kim is a notable inventor based in Changwon-si, South Korea. He has made significant contributions to the field of surface engineering, particularly in the development of methods for creating advanced surface properties.

Latest Patents

Seok Kim holds a patent for a "Method for manufacturing omniphobic surface using capillary force." This innovative method relates to the creation of a micropattern surface with a reentrant structure that exhibits both hydrophobic and oleophobic properties. The process involves several steps, including the application of an ultraviolet (UV) curable resin on a substrate, the formation of a fine pattern on another substrate, and the curing of the resin through UV radiation while utilizing capillary force to achieve the desired surface characteristics. He has 1 patent to his name.

Career Highlights

Seok Kim is affiliated with the Changwon National University Industry Academy Cooperation Corps, where he engages in research and development activities. His work focuses on innovative solutions that enhance material properties and applications in various industries.

Collaborations

Seok Kim collaborates with Su Hyun Choi, contributing to advancements in their field through shared expertise and innovative projects.

Conclusion

Seok Kim's work in the manufacturing of omniphobic surfaces showcases his commitment to innovation and excellence in surface engineering. His contributions are paving the way for new applications and advancements in material science.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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