Hwaseong-si, South Korea

Seok-hong Kwon


Average Co-Inventor Count = 4.7

ph-index = 3

Forward Citations = 22(Granted Patents)


Company Filing History:


Years Active: 2016-2018

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4 patents (USPTO):Explore Patents

Title: Seok-hong Kwon: Innovator in Semiconductor Packaging

Introduction

Seok-hong Kwon is a prominent inventor based in Hwaseong-si, South Korea. He has made significant contributions to the field of semiconductor packaging, holding a total of 4 patents. His work is instrumental in advancing technology in this critical area.

Latest Patents

Kwon's latest patents include innovative designs for semiconductor packages. One of his patents describes a semiconductor package that features a base substrate with bonding pads and connection pads on its upper and lower surfaces. This package includes four semiconductor chips, each with multiple chip pads, connected by bonding wires. The arrangement of these chips is designed to optimize performance by ensuring that their edges face different edges of the substrate.

Another notable patent involves a semiconductor package that integrates a logic chip and two memory chips. The first memory chip is mounted on the logic chip, while the second memory chip is offset and placed on top of the first. This configuration allows for efficient electrical connections between the two memory chips through solder bumps, enhancing the overall functionality of the package.

Career Highlights

Seok-hong Kwon is currently employed at Samsung Electronics Co., Ltd., a leading global technology company. His role at Samsung has allowed him to work on cutting-edge semiconductor technologies, contributing to the company's reputation for innovation and excellence in the electronics industry.

Collaborations

Kwon has collaborated with notable colleagues, including Hee-jin Lee and Sang-nam Jeong. These partnerships have fostered a collaborative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

Seok-hong Kwon's contributions to semiconductor packaging exemplify his innovative spirit and dedication to advancing technology. His patents reflect a deep understanding of the complexities involved in semiconductor design, positioning him as a key figure in the industry.

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