Seok Bong Kim

Title: Innovations by Seok Bong Kim in Semiconductor Technology

Introduction

Seok Bong Kim is a notable inventor based in Seoul, South Korea. He has made significant contributions to the field of semiconductor technology, holding two patents that showcase his innovative approach to manufacturing semiconductor devices.

Latest Patents

His latest patents include a semiconductor device and a manufacturing method thereof. This semiconductor device comprises a semiconductor die that includes a bond pad, a redistribution layer, and a solder ball. The redistribution layer is formed by sequentially plating copper and nickel, or vice versa, to enhance the device's reliability. A nickel layer is included in the redistribution layer to prevent cracks in the copper layer. Additionally, a projection is formed in the area of the redistribution layer where the solder ball is welded, increasing the bonding power between the solder ball and the redistribution layer.

Another patent focuses on a semiconductor device having a redistribution layer. Similar to his previous patent, it includes a semiconductor die with a bond pad, a redistribution layer, and a solder ball. The innovative design aims to improve the overall performance and durability of semiconductor devices.

Career Highlights

Seok Bong Kim is currently employed at Amkor Technology, Inc., where he continues to develop cutting-edge semiconductor solutions. His work has been instrumental in advancing the technology used in various electronic devices.

Collaborations

He collaborates with talented coworkers, including Jung Gi Jin and Jong Sik Paek, to drive innovation within the company.

Conclusion

Seok Bong Kim's contributions to semiconductor technology through his patents reflect his commitment to innovation and excellence in the field. His work not only enhances the performance of semiconductor devices but also sets a benchmark for future advancements.