The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 01, 2015
Filed:
Oct. 17, 2011
Jung Gi Jin, Jeju-do, KR;
Jong Sik Paek, Seoul, KR;
Sung Su Park, Seoul, KR;
Seok Bong Kim, Seoul, KR;
Tae Kyung Hwang, Seoul, KR;
SE Woong Cha, Seoul, KR;
Jung Gi Jin, Jeju-do, KR;
Jong Sik Paek, Seoul, KR;
Sung Su Park, Seoul, KR;
Seok Bong Kim, Seoul, KR;
Tae Kyung Hwang, Seoul, KR;
Se Woong Cha, Seoul, KR;
Abstract
A semiconductor device and method of manufacturing the same are provided. The semiconductor device comprises a semiconductor die including a bond pad, a redistribution layer, and a solder ball. The redistribution layer is formed by sequentially plating copper and nickel, sequentially plating nickel and copper, or sequentially plating copper, nickel, and copper. The redistribution layer includes a nickel layer in order to prevent a crack from occurring in a copper layer. Further, a projection is formed in an area of the redistribution layer or a dielectric layer to which the solder ball is welded and corresponds, so that an area of the redistribution layer to which the solder ball is welded increases, thereby increasing bonding power between the solder ball and the redistribution layer.