Tokyo, Japan

Seishi Watanabe

USPTO Granted Patents = 5 

Average Co-Inventor Count = 2.1

ph-index = 3

Forward Citations = 13(Granted Patents)


Company Filing History:


Years Active: 2009-2022

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5 patents (USPTO):Explore Patents

Title: Seishi Watanabe: Innovator in Semiconductor and Construction Technologies

Introduction

Seishi Watanabe is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the fields of semiconductor technology and construction engineering. With a total of 5 patents to his name, Watanabe's work has had a lasting impact on various industries.

Latest Patents

Watanabe's latest patents include innovations in resin packages and semiconductor light-emitting devices. His resin package design incorporates a printed circuit board with a resin layer and metallic layers, which enhances the reliability of semiconductor light-emitting devices. This design prevents warping of the printed circuit board, making it suitable for use in vehicle lamps and other applications. Additionally, he has developed a method for constructing steel-framed concrete beams, which includes a unique binding beam design that utilizes a steel form to enhance structural integrity.

Career Highlights

Throughout his career, Seishi Watanabe has worked with notable companies such as Stanley Electric Co., Ltd and Takenaka Corporation. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking projects in his field.

Collaborations

Watanabe has collaborated with esteemed colleagues, including Minoru Tanaka and Yoshihiro Ogawa. These partnerships have fostered innovation and have led to the development of advanced technologies.

Conclusion

Seishi Watanabe's contributions to semiconductor technology and construction engineering exemplify his innovative spirit and dedication to improving industry standards. His patents reflect a commitment to reliability and efficiency, making him a noteworthy figure in the world of inventions.

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