The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 21, 2022
Filed:
Dec. 19, 2018
Stanley Electric Co., Ltd., Tokyo, JP;
STANLEY ELECTRIC CO., LTD., Tokyo, JP;
Abstract
Reliable resin packages and semiconductor light-emitting devices using the resin package can include a printed circuit board including a resin layer, metallic layers formed on a top surface of the resin layer and underneath a bottom surface of the resin layer and a frame arranged from a top surface of the printed circuit board toward a bottom surface of the printed circuit board. The semiconductor light-emitting device using the resin package can prevent the printed circuit board from warping toward the frame when forming the frame incorporating the printed circuit board because a total of each thickness of the metallic layers formed on the top surface and underneath the bottom surface of the resin layer can be thicker than a thickness of the resin layer. Thus, the present invention can provide the semiconductor light-emitting devices having high reliability, which can be used as a light source for vehicle lamps, etc.