Shiga, Japan

Seiichi Takasu


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2014

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1 patent (USPTO):Explore Patents

Title: The Innovations of Seiichi Takasu

Introduction

Seiichi Takasu is a notable inventor based in Shiga, Japan. He has made significant contributions to the field of integrated circuit packaging. His innovative approach has led to the development of a unique manufacturing apparatus that enhances the efficiency of integrated circuit production.

Latest Patents

Takasu holds a patent for a production device, production method, test apparatus, and integrated circuit package. This patent describes a manufacturing apparatus designed to package an integrated circuit chip. The apparatus includes a flattening section that flattens the integrated circuit chip, a holding section that secures a base substrate, a transporting section that moves the flattened chip to the base substrate, and a packaging section that combines both components into a complete integrated circuit package. He has 1 patent to his name.

Career Highlights

Seiichi Takasu is currently employed at Adv Antest Corporation, where he continues to innovate in the field of integrated circuits. His work has been instrumental in advancing manufacturing techniques and improving product quality.

Collaborations

Takasu has collaborated with notable colleagues such as Yoshinari Kogure and Sadaki Tanaka. Their combined expertise has contributed to the success of various projects within the company.

Conclusion

Seiichi Takasu's contributions to integrated circuit packaging demonstrate his commitment to innovation and excellence in technology. His patent and ongoing work at Adv Antest Corporation highlight his role as a key figure in the industry.

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