Adv Antest Corporation

Seiichi Takasu

Yoshinari Kogure

Sadaki Tanaka

Provided is a manufacturing apparatus that manufactures an integrated circuit package by packaging an integrated circuit chip, the manufacturing apparatus comprising a flattening section that flattens the integrated circuit chip; a holding section that holds a base substrate; a transporting section that transports the flattened integrated circuit chip to load the integrated circuit chip on the base substrate held by the holding section; and a packaging section that packages the integrated circuit chip and the base substrate as the integrated circuit package.

Growing community of inventors

Shiga, Japan

Seiichi Takasu