Seiichi Ishikawa

Title: Seiichi Ishikawa: Innovator in Liquid Sealing Materials

Introduction

Seiichi Ishikawa is a notable inventor based in Niigata, Japan. He has made significant contributions to the field of liquid sealing materials, holding a total of 3 patents. His work focuses on enhancing the performance and reliability of electronic components through innovative sealing solutions.

Latest Patents

Ishikawa's latest patents include a liquid sealing material and an electronic component utilizing this material. The primary aim of his invention is to provide a liquid sealing material that exhibits excellent pressure cooker test (PCT) resistance. This liquid sealing material comprises several key components: (A) a liquid epoxy resin, (B) a curing agent, (C) a silica filler, and (D) a coupling agent. Notably, the silica filler is characterized by a boron content averaging between 1-50 ppm, which contributes to the material's enhanced properties.

Career Highlights

Seiichi Ishikawa is currently associated with Namics Corporation, where he continues to develop innovative solutions in the field of sealing materials. His expertise and dedication to research have positioned him as a valuable asset in his organization.

Collaborations

Throughout his career, Ishikawa has collaborated with esteemed colleagues such as Haruyuki Yoshii and Kazuyuki Kohara. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Seiichi Ishikawa's contributions to the field of liquid sealing materials demonstrate his commitment to advancing technology in electronic components. His innovative patents reflect a deep understanding of material science and engineering, making him a prominent figure in his industry.