Sehoon Jang

Title: Sehoon Jang: Innovator in Semiconductor Packaging

Introduction

Sehoon Jang is a prominent inventor based in Hwaseong, South Korea. He is known for his contributions to the field of semiconductor packaging, particularly through his innovative methods that enhance the efficiency and performance of electronic devices.

Latest Patents

Sehoon Jang holds a patent for a "Method of manufacture of fan-out type semiconductor package." This method involves several key steps, including forming a first wiring structure, connecting a semiconductor chip to this structure, and creating a lower encapsulant that covers part of the lateral surface of the chip without obscuring its upper surface. An upper encapsulant is then formed on the lower encapsulant, which covers the upper surface of the semiconductor chip and has a different composition than the lower encapsulant. Finally, a second wiring structure is formed on the upper encapsulant. This innovative approach is designed to improve the overall functionality and reliability of semiconductor packages.

Career Highlights

Sehoon Jang is currently employed at Samsung Electronics Co., Ltd., a leading global technology company. His work at Samsung has allowed him to be at the forefront of semiconductor technology, contributing to advancements that are critical in today’s electronic landscape.

Collaborations

Sehoon Jang collaborates with fellow inventor Sangkyu Lee, working together to push the boundaries of semiconductor technology and develop new solutions that meet the demands of modern electronics.

Conclusion

Sehoon Jang's innovative methods in semiconductor packaging exemplify the critical role inventors play in advancing technology. His contributions not only enhance the performance of electronic devices but also pave the way for future innovations in the field.