This inventor holds 2 USPTO granted patents and 4 published patent applications. Top assignee: Samsung Electronics Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Sehoon Jang and Semiconductor Packaging Innovation.
Introduction
Sehoon Jang is an inventor associated with Suwon-si, South Korea, and Samsung Electronics Co., Ltd. His patent work concerns semiconductor packaging and the manufacturing of semiconductor packages.
Latest Patents
The provided information lists one patent for Jang: “Semiconductor Package and Method of Manufacturing the Same.” The invention describes a package with a redistribution wiring layer, a conductive bump, and a semiconductor device mounted on the bump. The wiring layer includes redistribution vias and lines, a bonding pad, and an insulating layer with an opening that exposes part of the bonding pad.
Career Highlights
Jang’s listed patent reflects work on the structure and fabrication of semiconductor packages. The design integrates redistribution wiring and bonding features to support connections between package components. The supplied information identifies Samsung Electronics Co., Ltd. as his company.
Collaborations
Dongwook Kim is identified as Jang’s coworker. The available details do not specify their roles in the patent or describe a particular collaboration.
Conclusion
Sehoon Jang’s listed patent focuses on semiconductor package construction and manufacturing, highlighting his contribution to packaging technology at Samsung Electronics Co., Ltd. His record includes 1 patent.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile