The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2026
Filed:
Mar. 14, 2023
Samsung Electronics Co., Ltd., Suwon-si, KR;
Hyeonjeong Hwang, Suwon-si, KR;
Dongwook Kim, Suwon-si, KR;
Kyounglim Suk, Suwon-si, KR;
Inhyung Song, Suwon-si, KR;
Sehoon Jang, Suwon-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
A semiconductor package includes a redistribution wiring layer having a first surface and a second surface opposite to the first surface, a conductive bump on the first surface, and a first semiconductor device on the conductive bump. The redistribution wiring layer includes redistribution wirings having an uppermost redistribution wiring, a bonding pad, and an uppermost insulating layer. The uppermost redistribution wiring has a redistribution via and a redistribution line on the redistribution via. The bonding pad disposes on the redistribution line of the uppermost redistribution wiring, and the conductive bump is disposed on the bonding pad. The uppermost insulating layer overlapping (e.g., covering) the uppermost redistribution wiring and having an opening exposing a portion of the bonding pad.