See-Huat Tan

Title: Innovations of See-Huat Tan in MEMS Technology

Introduction

See-Huat Tan is a prominent inventor based in North Ryde, Australia. She has made significant contributions to the field of microelectromechanical systems (MEMS) technology. With a total of five patents to her name, her work focuses on enhancing the functionality and reliability of electronic assemblies.

Latest Patents

One of her latest patents is for a MEMS chip assembly having multiple trenches. This innovative design includes a support structure with a chip mounting surface, where a MEMS chip is mounted. The MEMS chip features an active surface with rows of MEMS devices and bond pads. The design ensures that the encapsulant material does not encroach past the trenches towards the MEMS devices, enhancing the overall performance of the assembly.

Another notable patent is for an inkjet printhead having robust encapsulation of wirebonds. This electronic assembly consists of a substrate with a die and PCB mounted on it. The wirebonds interconnect the bond pads of the die with the contact pads of the PCB. The encapsulation design includes a dam encapsulant and fill encapsulants with varying moduli of elasticity, which improves the durability of the wirebonds.

Career Highlights

See-Huat Tan is currently employed at Memjet Technology Limited, where she continues to innovate in the field of MEMS technology. Her work has been instrumental in advancing the capabilities of electronic devices, particularly in the area of print technology.

Collaborations

Throughout her career, See-Huat has collaborated with talented individuals such as Elmer Dimaculangan Perez and Angus John North. These collaborations have contributed to the successful development of her patented technologies.

Conclusion

See-Huat Tan's contributions to MEMS technology through her innovative patents demonstrate her expertise and commitment to advancing electronic assembly designs. Her work continues to influence the industry and pave the way for future innovations.