The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 15, 2020

Filed:

May. 01, 2019
Applicant:

Memjet Technology Limited, Dublin, IE;

Inventors:

Elmer Dimaculangan Perez, North Ryde, AU;

Angus North, North Ryde, AU;

Graeme Lowe, North Ryde, AU;

See-Huat Tan, North Ryde, AU;

Christopher Barton, North Ryde, AU;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/045 (2006.01); B41J 2/14 (2006.01); B81B 7/00 (2006.01); B41J 2/145 (2006.01); B41J 2/16 (2006.01);
U.S. Cl.
CPC ...
B41J 2/145 (2013.01); B41J 2/04541 (2013.01); B41J 2/14024 (2013.01); B41J 2/14072 (2013.01); B41J 2/1601 (2013.01); B81B 7/0032 (2013.01); B41J 2202/15 (2013.01); B81B 2201/052 (2013.01);
Abstract

A MEMS chip assembly including: a support structure having a chip mounting surface; a MEMS chip mounted on the chip mounting surface, each MEMS chip having an active surface including one or more MEMS devices and a plurality of bond pads disposed alongside a connection edge of the MEMS chip; electrical connectors connected to the bond pads; and an encapsulant material covering the electrical connectors. The MEMS chip has encapsulant-retaining trenches defined in the active surface extending alongside the connection edge, each encapsulant-retaining trench being disposed between the bond pads and the MEMS devices.


Find Patent Forward Citations

Loading…