North Ryde, Australia

Elmer Dimaculangan Perez

USPTO Granted Patents = 5 

 

Average Co-Inventor Count = 5.8

ph-index = 1


Company Filing History:


Years Active: 2020-2024

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5 patents (USPTO):Explore Patents

Title: Elmer Dimaculangan Perez: Innovator in MEMS Technology

Introduction

Elmer Dimaculangan Perez is a notable inventor based in North Ryde, Australia. He has made significant contributions to the field of microelectromechanical systems (MEMS) technology. With a total of five patents to his name, Perez continues to push the boundaries of innovation in electronic assembly and chip design.

Latest Patents

One of his latest patents is for a MEMS chip assembly having multiple trenches. This invention includes a support structure with a chip mounting surface, where a MEMS chip is mounted. The MEMS chip features an active surface with rows of MEMS devices and bond pads. The design incorporates electrical connectors and an encapsulant material that protects the electrical components without encroaching on the MEMS devices.

Another significant patent is for an inkjet printhead with robust encapsulation of wirebonds. This electronic assembly consists of a substrate with a die and PCB. Wirebonds connect the bond pads of the die to the contact pads of the PCB. The encapsulation process involves a dam encapsulant and fill encapsulants with varying moduli of elasticity, ensuring durability and reliability in electronic applications.

Career Highlights

Elmer Perez is currently employed at Memjet Technology Limited, where he applies his expertise in MEMS technology. His work focuses on developing innovative solutions that enhance the performance and reliability of electronic devices.

Collaborations

Throughout his career, Perez has collaborated with talented individuals such as See-Huat Tan and Angus John North. These partnerships have contributed to the advancement of technology in their respective fields.

Conclusion

Elmer Dimaculangan Perez is a distinguished inventor whose work in MEMS technology has led to several impactful patents. His contributions continue to shape the future of electronic assembly and chip design.

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