Suwon, South Korea

Sechul Park

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Samsung Electronics Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Sechul Park. Retrieved from https://idiyas.com/inventor/sechul-park-8lyeaf6x

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Sechul Park - Innovator in Semiconductor Technology

Introduction

Sechul Park is an inventor based in Suwon-si, South Korea. He is known for his contributions to the field of semiconductor technology. Although he currently holds no granted patents, his work in developing innovative semiconductor packages is noteworthy.

Latest Patent Applications

Sechul Park has filed several patent applications that showcase his expertise in semiconductor packaging. One of his latest applications is for a semiconductor package and method of manufacturing the same. This application describes a semiconductor package that includes a first redistribution structure, a first semiconductor chip, and a first molding layer with specific features designed to enhance performance. Another application focuses on a semiconductor package and system that includes a substrate with multiple regions designed to connect semiconductor chips in a unique bent form. These applications reflect his commitment to advancing semiconductor technology.

Conclusion

Sechul Park is an innovative inventor whose work in semiconductor packaging demonstrates his potential to contribute significantly to the field. His latest patent applications highlight his focus on developing advanced technologies that could shape the future of semiconductor design.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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