This inventor holds 1 USPTO granted patent. Top assignee: Frontgrade Technologies Inc.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Sean Brinlee: Inventor of a Ball Grid Array Assembly Method
Introduction
Sean Brinlee is an inventor based in Woodland Park, Colorado. His patent work addresses a manufacturing method for ball grid array (BGA) assemblies, a type of electronic packaging.
Latest Patents
Brinlee is associated with 1 patent, titled “Ball Grid Array Assembly Using a Solder Paste Mix and Method of Using a Solder Paste Dip.” The patent describes coating at least part of each BGA solder ball with a solder paste mix, then mounting the coated balls onto a secondary board to form the assembly.
Career Highlights
Brinlee’s disclosed invention focuses on applying solder paste to BGA solder balls as part of the assembly process. He is associated with Frontgrade Technologies Inc.
Collaborations
Scott Popelar and Julie Hook are identified as Brinlee’s coworkers.
Conclusion
Sean Brinlee’s patent highlights his contribution to BGA assembly manufacturing through a method that uses a solder paste mix when mounting solder balls to a secondary board.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile