The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 2026
Filed:
May. 25, 2022
Applicant:
Cobham Advanced Electronic Solutions Inc., Arlington, VA (US);
Inventors:
Scott Popelar, Colorado Springs, CO (US);
Julie Hook, Colorado Springs, CO (US);
Sean Brinlee, Woodland Park, CO (US);
Assignee:
Frontgrade Technologies Inc., Colorado Springs, CO (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10W 70/05 (2026.01); H10W 70/66 (2026.01); H10W 72/00 (2026.01); H10W 72/20 (2026.01); H10W 74/15 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 70/098 (2026.01); H10W 70/093 (2026.01); H10W 70/66 (2026.01); H10W 90/701 (2026.01); H10W 72/0112 (2026.01); H10W 72/01215 (2026.01); H10W 72/01257 (2026.01); H10W 72/255 (2026.01); H10W 74/15 (2026.01); H10W 90/724 (2026.01); H10W 90/734 (2026.01); H10W 90/754 (2026.01);
Abstract
A method for manufacturing a ball grid array (BGA) assembly is disclosed. An example method may include coating at least a portion of each solder ball of a BGA in a solder paste mix. The method may further include mounting the BGA onto a secondary board to form the BGA assembly, wherein mounting the BGA on the secondary board comprises mounting each solder ball coated with the solder paste mix to the secondary board.