Se Won Park

Title: Se Won Park - Innovator in Printed Circuit Board Technology

Introduction

Se Won Park is a notable inventor based in Seoul, South Korea. He has made significant contributions to the field of printed circuit board technology, holding a total of 2 patents. His work focuses on innovative methods and designs that enhance the functionality and manufacturing processes of printed circuit boards.

Latest Patents

Se Won Park's latest patents include a printed circuit board featuring a via pad with concavo-convex patterns and a method for manufacturing the same. This invention provides a printed circuit board that includes a circuit pattern formed on a first insulating layer, with a via pad that is spaced apart from the circuit pattern. The via pad is designed with a cross-section larger than that of the via hole and incorporates concavo-convex patterns. Additionally, he has developed a method for manufacturing a printed circuit board that has a buried pattern, which involves forming a second insulation layer on a first insulation layer and filling openings with conductive metal to create a circuit layer.

Career Highlights

Throughout his career, Se Won Park has worked with prominent companies such as Samsung Electro-Mechanics Co., Ltd. and Samsung SDS Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to advancements in technology.

Collaborations

Se Won Park has collaborated with talented individuals in his field, including Watanabe Ryoichi and Min Jung Kim. These partnerships have fostered innovation and the exchange of ideas, further enhancing his contributions to printed circuit board technology.

Conclusion

Se Won Park is a distinguished inventor whose work in printed circuit board technology has led to significant advancements in the industry. His innovative patents and collaborations reflect his commitment to enhancing manufacturing processes and designs.